Have you booked to attend the 2015 National Technical Forums?

Have you booked to attend the 2015 National Technical Forums? Don’t delay!

Private Label Packaging, chemical migration from packaging into food, lifecycle analysis, design for the aging and understanding shelf ready packaging are just some of the topics that will be presented at the 2015 National Technical Forums which will be held alongside of AUSPACK. With 40 speakers from 8 countries across four days the 2015 National Technical Forums are another reason to attend AUSPACK. Why not send your staff along to understand more about the world of packaging.

Sponsors of the 2015 National Technical Forums are Integrated Machinery, GE, KHS, GunnLab, Metalprint, Rockwell Automation, UPM Raflatac, Wellman Packaging and Cormack Packaging.

To reserve your place click here…